The PCBA board is an electronic component that serves as a base for other electronic components. It can be installed on the motherboard or printed circuit board by various techniques, such as welding, soldering and gluing. The process of manufacturing PCBA boards depends on the type of products, but generally consists of three steps: PCB assembly, testing and packaging.
It is necessary to test the PCBA board before assembly.
It is necessary to test the PCBA board before assembly. The test process is divided into three parts:
- Test the components separately
- Test the module in combination with other modules
- Assembly of PCBA boards
Step: 1 SMT patch processing
The SMT patch is a small piece of copper foil that is used to connect the chip and the PCB board. The SMT patch can be seen as a bridge between two parts of the solder mask, which forms an electrical connection between them. The chip is not mounted directly on top of its pads but rather connected to them via this patch.
Step: 2 DIP plug-in processing
The DIP plug-in processing is a process of placing semiconductor devices (DIP) into plastic or metal sockets. The device may be an integrated circuit, resistor, diode or other electronic component and it will be plugged directly into a printed circuit board via the socket pins.
The DIP plug-in process is used to connect integrated circuits, resistors, diodes and other electronic components onto printed circuit boards. It involves mounting the chip directly on a substrate with solder balls for each pin (they can also be attached with wire leads). Then these substrates are passed through a machine that mechanically inserts them into sockets at high speed.
Step: 3 BGA patch processing
BGA (ball grid array) is a type of electronic connection. It is used in high-end chips, motherboards and other boards, chipsets. It is a surface-mounted technology, which means that the chip is attached to the PCB by tiny balls of solder instead of pins. In order to connect BGA chips to a PCB, you have to first fix them in place using an adhesive.
Step: 4 PCB AOI test processing
The AOI test is a test of the PCB board. This process involves testing the PCB board and then inspecting it. It is widely used in the industry because of its high accuracy and high efficiency, so it can greatly improve the production efficiency of PCB manufacturers.
Step: 5 PCB function test
In the process of PCB function test, an interface is provided to the customer through which they can make the design of their product. The specific requirements are also set by the customer themselves. In addition to this, it is necessary for them to provide a description of their application and how it will be used in real life situations. This information helps us determine which testing method we should use for each type of circuit board we design. For example:
- If your product requires high frequency signals (the frequency above 1 GHz), then you must use the “pulse” test method for your tests instead of other methods such as “noise immunity”.
- If your board has high density surface mount devices (SMD), then you must use a solder reflow oven rather than an IR reflow oven when performing temperature tests on them because SMD components have smaller thermal properties compared with through-hole components which are larger in size and have more surface area that can absorb heat from infrared light sources like IR reflow ovens
Conclusion
The bottom line is that you should always use the correct test method for your PCBs. If you are unsure about which method to use, then it’s best to consult with a technician or engineer who knows about these things. The last thing you want is to spend money on materials and time performing tests only to find out later that they were not performed correctly and may need to be redone all over again.
